The Future is Forming

The Tool and Die Authority December 2008 Newsletter contained these articles:

Strange Times Call for Strange Bedfellows: Joe Brown
Failure Analysis for Stamping Dies, Part 2: Tool-Steel Heat treatment: Peter Ulintz
Time-Saving Alternatives for the Toolroom—Part 2: Bob Quinn
Error-Proofing Proactively with Proper Setups: Drew Stevens


and from Danny Schaeffler of Engineering Quality Solutions (EQS)
The Case for Thinning Strain Analysis

The past two editions of this series discussed circle grid strain analysis and the potential errors that improper technique can induce in your results. The easiest way to check your measurements is to compare the thickness calculated from your circle-grid surface-strain measurements to thickness measurements made using an ultrasonic thickness (UT) gauge. But, there is so much more information you can get from your part and process with just thickness measurements!
Thinning strain analysis (TSA) is easier to perform than circle grid analysis (CGA), and requires very little operator training. TSA can be performed on any formed part, without special preparation of the blank or tools before stamping, and it requires less stamping-plant involvement and assistance. Production stamping schedules are less likely to be disrupted when a TSA is needed, and TSA can be used when is it not practical to place circle grids on a blank— such as for parts stamped on a progressive die or in the central portion of a very large blank. ...

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Posted by Engineering Quality Solutions on Friday, July 10, 2009 at 8:05 AM | Permalink |